Surface Metallization Method of Industrial Ceramic Plate-Thick Film Method

There are many methods for surface metallization of industrial ceramic substrates. The co-firing method is introduced above. By co-firing at high temperature or low temperature, the performance of zirconia ceramics and alumina ceramic substrates is enhanced and more beautiful. Next, Kezhong Ceramics Factory will continue to introduce thick film surface metallization for everyone.

Thick film method refers to the manufacturing process that conductive paste is directly coated on the ceramic substrate by screen printing, and then the metal layer is firmly attached to the ceramic substrate by high temperature sintering. The selection of thick film conductor paste is the key factor to determine the thick film process, which consists of functional phase (that is, metal powder with particle size of 2μ M), a bonding phase (binder) and an organic carrier.

The functional phase metal powders are generally Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al and W, among which Ag, Ag/Pd and Cu are the majority. Binder is usually glass frit or metal oxide or their mixture. Its function is to connect ceramics and metals and determine the adhesion of thick film paste to matrix ceramics, which is the key to making thick film paste. The main function of the organic carrier is to disperse the functional phase and the adhesive phase, and at the same time, keep the thick film slurry at a certain viscosity, so as to prepare for the subsequent screen printing, which will gradually evaporate during the sintering process.

At present, the research on alumina thick film electronic paste has become mature, while aluminum nitride thick film electronic paste still has a large development space.

Website: https://www.zhengtaifeng.com/