Brief introduction of metal surface technology of industrial ceramic plate

Most industrial ceramics are white in color, so many people carry out metal surface processing on some industrial ceramic plates for aesthetic optimization, thus making their application range more extensive. The following Kezhong Ceramics Factory will introduce the co-firing technology to you first.

With the development of microelectronic products tending to function diversification, high performance and miniaturization, especially the development of 5G communication technology requires communication equipment (network base stations and large filters) to have higher power. Therefore, ceramic substrates have a very wide application prospect in the fields of high-power LED industry, high-frequency electronic equipment, large-scale network base stations, filter devices and so on because of their excellent characteristics such as low thermal resistance, high voltage resistance, high heat dissipation and long service life. The surface metallization of ceramic substrate is an important prerequisite to determine its practical application.

First, co-firing method

Co-fired multilayer ceramic substrates have attracted wide attention because they can meet many requirements of integrated circuits by embedding passive components such as signal lines and micro-wires into the substrates by thick film technology.

Co-firing method is divided into high-temperature co-firing and low-temperature co-firing. The process flow of the two methods is basically the same. First, ceramic powder and organic adhesive are mixed to form slurry, then the slurry is processed into sheets by scraper, and then ceramic green bodies are formed after drying. Then, according to the design requirements, through holes are processed on the green bodies and filled with metal powder, and the surface of the green bodies is coated by screen printing technology to form circuit patterns. Finally, the layers of green bodies are laminated and pressed, and sintering and molding are completed in a co-firing furnace. The details are as follows:

The high-temperature co-firing temperature is 1300~1600℃, while the low-temperature sintering temperature is 850~900℃. The main reason for this difference is that the glass material which can reduce the sintering temperature is added into the low-temperature sintering slurry.

The advantages of co-firing method for ceramic substrate surface metallization are: increasing assembly density, shortening interconnection length, reducing signal delay, reducing volume, improving reliability, etc., especially suitable for high-frequency communication components.

The disadvantage is that it is also easy to cause problems such as inaccurate graphic alignment and excessive tolerance accumulation during lamination.

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