Surface Metallization Method of Ceramic Substrate-Direct Copper Plating Method

There are many methods to metallize the surface of ceramic substrate, but the simplest one is the direct copper plating method. By combining copper foil with ceramics on the surface of zirconia ceramics, the following is a brief introduction of the copper plating method in Kezhong Ceramics Factory.

Direct copper plating is a metallization method for bonding copper foil on ceramic surfaces (mainly Al2O3 and AlN), which is a new technology developed with the rise of chip on board packaging technology. The basic principle is that oxygen is introduced between Cu and ceramics, and then Cu/O eutectic liquid phase is formed at 1065~1083℃, and then reacts with ceramic matrix and copper foil to generate CuAlO2 or Cu(AlO2)2, and the copper foil is bonded to the matrix under the action of mesophase. Because AlN belongs to non-oxide ceramics, the key to copper plating on its surface is to form an Al2O3 transition layer on its surface, and realize the effective bonding between copper foil and matrix ceramics under the action of the transition layer.

Copper foil has good electrical and thermal conductivity, while alumina not only has the advantages of good thermal conductivity, strong insulation and high reliability, but also can effectively control the expansion of CuAl _ 2O _ 3-Cu complex, so that the ceramic substrate prepared by direct copper plating method has a thermal expansion coefficient similar to that of alumina, which is widely used in the packaging and heat dissipation management of IGBT, LD and CPV.

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