Surface Metallization Method of Ceramic Substrate-Direct Aluminizing Method

The method of directly coating copper on the surface of ceramic substrate is introduced above. In fact, the metallization of ceramic surface is not limited to copper. The surface metallization of zirconia ceramics can also be carried out by aluminum coating. The following is a brief introduction by Kezhong Ceramics Factory.

Direct aluminum coating method is to use aluminum to have good wettability to ceramics in liquid state to realize the bonding of the two. When the temperature rises above 660℃, the solid aluminum will liquefy. When the liquid aluminum wets the ceramic surface, with the decrease of temperature, the crystal nucleus provided by aluminum directly on the ceramic surface will grow, and the combination of the two will be realized after cooling to room temperature. In this process, aluminum is active, and it is easy to oxidize to form Al2O3 film at high temperature, which exists on the surface of aluminum liquid, greatly reducing the wettability of aluminum liquid on ceramic surface, making it difficult to achieve bonding. Therefore, it must be removed before bonding or bonded under oxygen-free conditions.

The advantages of direct aluminizing method for ceramic substrate surface metallization are good thermal stability, excellent thermal conductivity, good thermal shock fatigue resistance and good aluminum wire bonding ability. Compared with the direct aluminizing method with the same structure, the quality can be reduced by 44%, the aluminum wire bonding ability is good, and the thermal stress between aluminum and ceramics is relatively small. At present, this technology has developed rapidly and has been successfully applied in automobile industry.

At present, a lot of research work has been done on DAB technology at home and abroad, but the research on the details of aluminum/ceramic interface is not deep enough.

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