Precision machining of zirconia ceramic ceramics - Grinding and polishing processing

There are many methods for ceramic precision machining, the most common of which are polishing and grinding, which can process ceramic ingredients into smooth surface ceramic parts. Below, Kezhong Ceramic Factory will introduce these two processing methods in detail.

Grinding and polishing of zirconia ceramics is a super precision machining method that uses free abrasives to achieve micro removal of surface materials to achieve machining results. In the ultra precision machining and finishing of ceramic materials, especially in the precision machining of ceramic balls used in ceramic bearings, grinding and polishing processing have irreplaceable positions.

There are many methods for ceramic precision machining, the most common of which are polishing and grinding, which can process ceramic ingredients into smooth surface ceramic parts. Below, Kezhong Ceramic Factory will introduce these two processing methods in detail.

Grinding and polishing of zirconia ceramics is a super precision machining method that uses free abrasives to achieve micro removal of surface materials to achieve machining results. In the ultra precision machining and finishing of ceramic materials, especially in the precision machining of ceramic balls used in ceramic bearings, grinding and polishing processing have irreplaceable positions.

The mirror surface of optical materials such as optical glass and sapphire, semiconductor materials such as silicon wafer and GaAs substrate, and ceramic materials such as zirconia ceramics and alumina ceramics are mostly processed by grinding and polishing.

From the perspective of material removal mechanism, grinding processing is a processing method that falls between the brittle failure and elastic removal of zirconia ceramics, while polishing processing is basically carried out within the elastic removal range of the material.

Grinding and polishing processing, due to the small removal amount of zirconia ceramic material and low processing efficiency, are generally only used for the final process of zirconia ceramic ultra precision machining.

The removal rate of zirconia ceramic material processed by grinding and polishing is closely related to the toughness of the added zirconia ceramic material. The higher the toughness of zirconia ceramic, the lower the processing efficiency of zirconia ceramic.

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