Introduction to New Polishing Technology for Engineering Ceramics

Our ceramic factory is a manufacturer specializing in the production of ceramic parts, which have high hardness and corrosion resistance chemical properties. Below, Kezhong Ceramic Factory will explain to you

Polishing processing usually refers to the use of the mechanical and chemical effects of fine abrasive particles, assisted by soft polishing tools or chemical processing fluids, electric/magnetic fields, etc., to obtain a smooth or ultra smooth surface, reduce or completely eliminate the processing deterioration layer, and thus obtain high surface quality processing methods.

Polishing differs from grinding in the selection of abrasives and grinding tool materials. Polishing usually uses 1 μ The polishing disc is made of soft metal or non-metallic materials such as asphalt, paraffin, synthetic resin, Artificial leather and tin for fine abrasive particles below m, which can automatically adjust the cutting depth of abrasive particles according to the contact state, slow down the scratch damage caused by larger abrasive particles on the machined surface, and improve the surface quality. At present, the removal units of abrasive machining are in the order of nanometers or even sub nanometers. Within this processing scale, the polishing process is accompanied by chemical reactions, and the chemical effects of the processing process cannot be ignored. If various chemical interactions between workpiece and abrasive particles, workpiece and processing fluid, and workpiece and grinding tool can be effectively utilized in machining, it can not only improve machining efficiency but also obtain a non-destructive machining surface.

When grinding ceramic nozzles made of hard and brittle materials, when the abrasive particles are small to a certain particle size and a soft material grinding disc is used, the difference in grinding and polishing caused by the different characteristics of the abrasive and the grinding disc changes the removal mechanism and surface formation mechanism of the workpiece material. It should be pointed out that in some cases, grinding and polishing of ceramic positioning blocks are difficult to distinguish, and the two terms are sometimes mixed.

1. Polishing mechanism

Due to the complexity and invisibility of the polishing process, the polishing mechanism is often explained through the experimental results obtained under specific experimental conditions. The polishing mechanism of brittle materials can be summarized as follows: polishing is mainly carried out by the small plastic cutting of abrasive particles to generate chips. During the material removal process, there will be direct chemical interactions between the workpiece and abrasive particles, dispensing ceramic processing fluid, and polishing discs due to local high temperature and pressure, and reaction products will be generated on the surface of the workpiece. Due to the overlap of these effects, as well as the mechanical effects of polishing fluid, abrasive particles, and polishing discs, the generated substances on the surface of the workpiece are continuously removed, resulting in surface smoothness. Different combinations of workpieces, abrasive grains, polishing discs, and processing fluids can achieve different polishing effects. The chemical reactions between the workpiece and the polishing fluid, as well as between the abrasive and the polishing disc, contribute to the polishing process.

2. Micro mechanical removal and chemical reactions

The surface roughness of the polished surface is a trace formed by mechanical, chemical, and other processes that generate chips, while the elastic-plastic deformation and small cracks present in the processing metamorphic layer can be considered as a part of the mechanical energy provided to generate chips. Therefore, in order to ensure processing quality, in polishing processing, chip generation conditions that reduce surface roughness and reduce machining deterioration layers should be adopted.

The smallest unit of material removal is assumed to be a layer of atoms, and the most basic material removal is to cut a layer of atoms on the surface and the atoms inside. In fact, completely removing a layer of atoms from the material is extremely difficult to process. Mechanical processing inevitably leaves a processing metamorphic layer, and the depth of the processing metamorphic layer varies depending on the material properties and processing conditions of the workpiece. Due to the complex phenomena such as chemical reaction during polishing, the thickness of the material removal layer of Sander ceramic sheet is a composite of several states from one layer of atoms to several layers of atoms or even tens of layers of atoms.

At present, the removal units of materials in polishing processing are already at the nanometer or even sub nanometer level. Within this processing scale, the chemical effects of the processing atmosphere become an indispensable part of polishing processing. Figure 4.3 shows the processing method of combining physical and chemical processes.

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