Research on New Grinding Technology for Engineering Ceramics

Our ceramic factory is a manufacturer specializing in the production of ceramic parts. Ceramic parts have high hardness, corrosion resistance, and chemical properties. Below, Kezhong Ceramic Factory will explain to you. Grinding processing usually refers to the use of micrometer level abrasive particles with higher hardness than the processed material, which are subjected to micro cutting and rolling effects under the action of hard grinding discs to remove trace materials from the processed surface, thereby improving the shape of the workpiece The processing method of achieving the required dimensional accuracy, reducing surface roughness, and reducing the processing deterioration layer.

Grinding mechanism

Engineering ceramic materials are hard, brittle, and difficult to machine materials. During the grinding process, the removal of the processed material depends on the rolling or micro cutting action of the abrasive particles. A model of abrasive action. The abrasive particles act on surfaces with convexity and micro cracks. As the grinding process progresses, a portion of the abrasive particles are pressed into the grinding disc due to the grinding pressure, and the exposed abrasive tip is used to scratch the surface of the workpiece for micro cutting processing; Another part of the ceramic needle gauge abrasive particles roll between the workpiece and the grinding plate, producing a rolling effect. Due to the lower tensile strength of hard and brittle materials compared to compressive strength, microcracks occur in the area with the highest tensile stress on the machined surface of hard and brittle materials under the action of abrasive particles. When crisscrossing cracks propagate and intersect with each other, the parts surrounded by the cracks will undergo brittle fracture and collapse into small fragments to form chips, thus achieving the goal of surface removal. This is the basic process of chip generation and surface formation mechanism during the grinding of hard and brittle materials. It can be seen that the rolling action is generated by free abrasive particles between the workpiece and the grinding disc, while the micro cutting action is generated by fixed abrasive particles embedded on the surface of the grinding disc. Therefore, the grinding process of hard and brittle materials is actually the result of the joint action of free abrasive particles and fixed abrasive particles. During the grinding process, the state of the abrasive particles depends on the material of the grinding disc and the processing load

If the minimum radius containing the crack area is defined as the length of the crack, and it is believed that the length of the surface and internal cracks is roughly equal, the greater the load, the longer the crack length that extends horizontally. This is a micrograph of the silicon surface crack.

When grinding hard and brittle materials, it is important to control the size and uniformity of the cracks generated. On the one hand, ceramic nozzles should ensure that there is no significant surface damage during processing; On the other hand, in order to improve processing efficiency, it is necessary to promote small crushing. By selecting the particle size of abrasive particles and controlling the uniformity of particle size, it is possible to avoid particularly large ceramic roller processing defects.

Website: https://www.zhengtaifeng.com/

Website: https://www.zhengtaifeng.com/