New Technology of Interface Reactive Polishing for Engineering Ceramics

Our ceramic factory is a manufacturer specializing in the production of ceramic parts, which have high hardness and corrosion resistance chemical properties. Below, Kezhong Ceramic Factory will explain to you

In the past, the processing of hard and brittle electronic functional ceramic materials mainly relied on the mechanical pressing and scratching effects of hard abrasive particles for grinding and polishing. Usually, there is a processing deterioration layer left on the surface of the workpiece. In order to eliminate the machining deterioration layer, chemical polishing and Electropolishing are generally used, but the shape accuracy will be reduced. In order to overcome the above shortcomings, it is necessary to develop new polishing methods to achieve high-precision and high-quality polishing of functional ceramics.

The wear phenomenon that exists at the interface of two objects is carried out in the form of removing surface substances, and we can consider this wear phenomenon as a processing phenomenon. If we can cleverly control this interface reaction, limit the reaction products to a very small depth on the surface, and remove them from the surface without damaging the parent material, it is possible to obtain an ultra precision surface that cannot be achieved by current polishing processing. The use of solid-state chemical reactions at the friction interface between abrasives and workpieces for machining has attracted attention as the foundation of various new polishing technologies.

Part of the mechanical energy at the friction interface between the workpiece and the abrasive is converted into thermal energy, causing the actual contact area of the interface to be in a high-temperature and high-pressure state. The interface in this state is unstable, and various substances are easy to penetrate each other, and compounds are easy to produce and decompose. This interfacial reaction is generally referred to as a mechanochemical reaction. If the reaction product is controlled within the extremely small ceramic injection molding depth on the surface of the workpiece, because its processing unit of Electroceramics is very small, it can fall off without damaging the base metal, and can obtain an ultra precision surface that is absolutely impossible for general machining. This is an interface reaction polishing method that generates easily removable local soft foreign objects while processing.

The interfacial reactions that can be used for polishing include mechanochemical Dry media reaction and hydration reaction. The corresponding polishing methods are called mechanochemical polishing and hydration polishing. Interface reaction polishing is currently the main method for precision machining of functional ceramic component substrates. So far, the possibility of using this new method has been demonstrated for sapphire, crystal, silicon photovoltaic ceramic parts, etc.

These new methods are completely different in processing mechanism from traditional polishing methods. Because it is unnecessary to make Viscoelasticity polishing disc, the flatness of machining can be improved. Due to the use of chemical reactions, the formed processing metamorphic layer is extremely small.

Part of the mechanical energy at the friction interface between the workpiece and the abrasive is converted into thermal energy, causing the actual contact area of the interface to be in a high-temperature and high-pressure state. The interface in this state is unstable, and various substances are easy to penetrate each other, and compounds are easy to produce and decompose. This interfacial reaction is generally referred to as a mechanochemical reaction. If the reaction product is controlled within the extremely small ceramic injection molding depth on the surface of the workpiece, because its processing unit of Electroceramics is very small, it can fall off without damaging the base metal, and can obtain an ultra precision surface that is absolutely impossible for general machining. This is an interface reaction polishing method that generates easily removable local soft foreign objects while processing.

The interfacial reactions that can be used for polishing include mechanochemical Dry media reaction and hydration reaction. The corresponding polishing methods are called mechanochemical polishing and hydration polishing. Interface reaction polishing is currently the main method for precision machining of functional ceramic component substrates. So far, the possibility of using this new method has been demonstrated for sapphire, crystal, silicon photovoltaic ceramic parts, etc.

These new methods are completely different in processing mechanism from traditional polishing methods. Because it is unnecessary to make Viscoelasticity polishing disc, the flatness of machining can be improved. Due to the use of chemical reactions, the formed processing metamorphic layer is extremely small.

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