High speed grinding technology for engineering ceramics

Our ceramic factory is a ceramic manufacturer that produces ceramic parts. The high-speed grinding technology of engineering ceramics aims to achieve high efficiency and quality, and the main means is to improve the linear speed of grinding wheels, achieving advanced processing technology for efficient material removal and processing. High speed grinding is relative to traditional ordinary grinding. Currently, grinding with a grinding wheel linear speed Vs>5 m/s can be referred to as high-speed grinding. Grinding with a grinding wheel linear speed Vs>150 m/s is usually referred to as ultra high speed grinding. High speed grinding includes technologies such as efficient deep grinding and fast point grinding. Efficient deep grinding is a high-efficiency grinding technology that integrates high grinding wheel speed, high feed speed (0-510m/min), and large cutting depth (0.1-30mm). Efficient deep grinding technology has been used for rough and precision machining of high-quality ceramic parts with high material removal rate and low cost. The rapid point grinding technology integrates three advanced manufacturing technologies: high-speed grinding, CBN superhard abrasive, and CNC flexible machining, with excellent machining performance. High speed grinding has the following advantages: significantly reducing grinding force and improving the machining accuracy of parts, which is of great significance for engineering ceramic grinding and can effectively reduce the probability of surface/subsurface fracture damage; The ceramic parts successfully cross the influence of grinding heat grooves, and residual compressive stress can be obtained on the surface layer of the workpiece; It can achieve ductile zone grinding on hard and brittle materials, and also has good grinding effects on high plasticity and difficult to grind materials; Workpieces that can achieve high quality and low surface roughness values.

The grinding wheel used for high-speed grinding is mainly made of cubic Boron nitride (CBN) and polycrystalline diamond (PCD). The use speed of diamond grinding wheels can reach 150m/s, while the linear speed of single-layer electroplated CBN grinding wheels can reach around 250m/s. High temperature brazing grinding wheels improve the bonding strength between abrasives, binders (brazing alloy materials), and ceramic nozzle substrates due to their ability to achieve interface chemical metallurgical bonding, greatly increasing the service life of the grinding wheel. The working line speed of the grinding wheel can reach over 300-500 m/s; Due to the sharpness of the grinding wheel and its large chip holding space, it is not easy to block. Therefore, under the same processing conditions as the electroplating grinding wheel, the grinding force, power consumption, and grinding temperature of the ceramic cutting tool will be lower, and even close to achieving cold grinding.

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