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Floating polishing mechanism
In the floating polishing mechanism, there are many lattice defects on the surface of crystalline materials. Therefore, the energy required to remove the surface atoms is much less than the energy required to destroy the atomic bonding of materials. The distribution of Binding energy on the surface of two substances overlaps. Therefore, the atoms on the surface of substances with high strength may be removed by the impact of atoms on the surface of substances with low strength. That is, soft particles are now used to process hard materials, And the workpiece material will not undergo plastic deformation and misalignment. The atoms on the outermost surface of the floating polishing workpiece and the atoms on the outermost surface of the abrasive particles diffuse each other under the local high temperature and pressure at the contact point, which reduces the combined impact frequency and impact speed of the atoms on the outermost surface of the workpiece. The work is related to the distribution of the Binding energy of the atoms on the surface of the abrasive particles and the difficulty of mutual diffusion. The Binding energy of the atoms on the outermost surface of the workpiece when impure matter atoms invade is reduced in proportion. For example, extremelact Dry media reaction with the workpiece can be used as polishing agIn the floating polishing mechanism, there are many lattice defects on the surface of crystalline materials. Therefore, the energy required to remove the surface atoms is much less than the energy required to destroy the atomic bonding of materials. The distribution of Binding energy on the surface of two substances overlaps. Therefore, the atoms on the surface of substances with high strength may be removed by the impact of atoms on the surface of substances with low strength. That is, soft particles are now used to process hard materials, And the workpiece material will not undergo plastic deformation and misalignment. The atoms on the outermost surface of the floating polishing workpiece and the atoms on the outermost surface of the abrasive particles diffuse each other under the local high temperature and pressure at the contact point, which reduces the combined impact frequency and impact speed of the atoms on the outermost surface of the workpiece. The work is related to the distribution of the Binding energy of the atoms on the surface of the abrasive particles and the difficulty of mutual diffusion. The Binding energy of the atoms on the outermost surface of the workpiece when impure matter atoms invade is reduced in proportion. For example, extremely soft graphite and water soluble LiF can be used to polish very hard sapphire. In order to improve the machining efficiency, soft abrasive that can react Dry media reaction with the workpiece can be used as polishing agent.
Floating polishing mechanism
Traditional methods use hard abrasive particles to polish soft workpieces, which is difficult to avoid surface damage to the workpiece. But when selecting hardness particles with extremely small diameters to impact the surface of the workpiece, and controlling the impact energy, only removing the outermost surface atoms will not cause misalignment of the surface layer of the workpiece material. For example, using SiO2 particles with a particle size of 7nm to polish soft Mn-Zn ferrite and LiNbO3 single crystal workpieces will not cause dislocation and proliferation, but large particles should be avoided during processing.
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