Introduction to Laser Processing Technology for Fine Micropores of Zirconia Ceramics

There are various drilling methods for zirconia ceramics, the most common of which are punch machines, internal and external circular grinding, and CNC drilling precision carving. Therefore, some ultra-fine micro hole machines cannot process them. Below, Kezhong Ceramic Factory will introduce the laser processing method for drilling.

Due to the high hardness and brittleness of special ceramic materials, they are difficult to machine, especially for deep holes and grooves with a diameter of less than 1mm. Currently, laser processing is widely used. The principle of laser processing is to utilize the high brightness and high directionality of lasers to concentrate light energy within a certain range of space, thereby obtaining a relatively high optical power density and generating high temperatures ranging from thousands to tens of thousands of degrees. At this high temperature, ceramic materials can quickly melt or even vaporize.

The working principle of laser processing determines many drawbacks of laser processing:

1. The workpiece processed by laser has defects such as molten solidification layer and cracks.

2. Due to the focusing process of the laser, the holes processed by the laser will appear conical or barrel shaped.

3. The depth to diameter ratio of laser drilling should not exceed 10mm, and the thickness should not exceed 2mm. For some thicker products, it cannot be processed.

We have developed new processes to address various defects in laser processing, precision machining and cutting of deep micropores and grooves in special ceramics. The machining diameter can reach 0.05mm, the depth can reach 12mm, and the ceramic holes have good roundness, high accuracy, and good surface roughness.

Website: https://www.zhengtaifeng.com/