Application of alumina ceramics in the field of microelectronics

With the rapid development of microelectronics technology, electronic devices tend to be high power, high density, multi-functional, the integration degree of electronic circuit is getting higher and higher, the circuit work inevitably generate a lot of heat. In order to prevent the components from being damaged due to heat accumulation, alumina ceramics with high thermal expansion coefficient matching semiconductor Si, high thermal stability, chemical stability and low dielectric constant, cheap and mature production process become the most used electronic substrate materials.

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But the pure alumina ceramic base is not conductive, so it must first be metallized, that is, on the surface of the ceramic coated with a layer of solid and not easy to melt the metal film, so that it conducts electricity. However, from a metallurgical point of view, intergranular, diffusion and bonding are very weak in the interaction between the ceramic and the surface metal coating; therefore, the influence of surface morphology is more prominent.

In order to improve the bonding strength of ceramic and metal coating as much as possible, the surface of the ceramic substrate must be etched to increase the roughness and contact area of the substrate surface appropriately, so as to obtain the ideal surface morphology and wettability. At the same time, care must be taken in the process of giving the ceramic surface catalytic activity, such as surface adjustment, catalysis and plating.