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New Discovery of Creep Feed Grinding Process in Ceramic Processing Technology
1. Selection of grinding wheel
(1) The abrasive suitable for slow feed grinding of Japanese ceramic materials is diamond, which mainly consists of three types: natural diamond (D), synthetic diamond (SD), and electroplated diamond (SDC).
(2) The commonly used binders for diamond grinding wheels include metal, resin, and ceramic binders. Grinding wheels for slow feed grinding generally use ceramic binders because of their high bonding strength, good shape retention, and the ability to form pores; At the same time, it also has good heat resistance, water resistance, and corrosion resistance, suitable for use in ceramic parts with various grinding fluids.
(3) The diamond particle size, which is usually coarser, can improve the lifespan of the grinding wheel and the material removal rate; Finer diamond particles can result in lower surface roughness. In addition, there is also a certain relationship between diamond particle size and grinding efficiency. Generally speaking, coarse particle size leads to high grinding efficiency and low grinding heat; Fine particle size, increased grinding power, and high grinding heat.
(4) Hardness creep feed grinding requires the grinding wheel to have good self sharpening performance. If the grinding wheel has high hardness and poor self sharpening performance, it is easy to burn the surface of the parts. Therefore, the grinding wheel used for slow feed grinding has a softer hardness than the grinding wheel used for conventional grinding. Difficult to machine materials should use ultra soft grades, while easy to grind materials should use soft grades.
(5) Due to the large amount of powder and granular debris generated by slow feed grinding, a large amount of debris will be stored within the contact arc length of the grinding wheel. Industrial ceramics can only be discharged after being washed by the grinding fluid. Therefore, the grinding wheel used for slow feed grinding needs to have certain pores to serve as a chip holding groove, that is, a loose grinding wheel with a relatively loose structure and a large amount of air debris will be selected.
2 Dressing of grinding wheels
The dressing of textile ceramic grinding wheels is usually divided into two processes: shaping and sharpening. By shaping, the required geometric accuracy of the grinding wheel can be obtained, while sharpening can remove the bonding between the abrasive particles, fully exposing the diamond abrasive particles, and forming a chip holding space.
The common dressing methods for diamond grinding wheels include grinding wheel rolling method, electrolytic dressing method, elastic ultrasonic dressing method, electric spark dressing method, online discharge electrolytic composite dressing method, and laser dressing method.
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