Industry information

Laser Processing Technology

Author:Vincent Huang Time:2023-06-21 Hits:


In 1960, T. Maiman of Hughes Company invented the world's first Ruby laser. Afterwards, people began to explore the application of lasers, a new type of coherent light source, in the field of material processing. In 1965, Nd: YAG and CO ₂ lasers continued to appear. Due to the ability of these two types of lasers to generate relatively high average rate density, the application of lasers in the field of material processing is possible. As a practical processing equipment in industrial production, the requirements for laser operation are reliability, stability, good beam quality, and adjustable output power.

By utilizing the height and high directionality of lasers, light energy can be concentrated within a certain range of space, resulting in a relatively high optical power density and generating high temperatures ranging from several thousand to tens of thousands of degrees. At such high temperatures, even high melting point ceramic materials can quickly melt or even vaporize. At present, laser drilling is a relatively mature application of laser processing ceramic technology. Laser cutting, laser marking, etc. The laser power required for general laser drilling and cutting is 150W-




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The main characteristics of laser processing are:

(1) Multiple processes such as drilling, cutting, welding, and surface treatment can be carried out simultaneously on a laser processing machine.

(2) Strong applicability. Capable of processing various existing engineering materials, particularly suitable for processing engineering ceramic materials.

(3) The control operation of the laser beam is easy to achieve automation. At the same time, there is no reaction force generated during the processing process, and the fixture structure is simple, which can process various parts with complex shapes.

However, laser processing of ceramics also has some drawbacks. Due to the low thermal conductivity of ceramic materials, if the process parameters are not selected properly, the high-energy laser beam may generate thermal stress concentration on the material surface, which is prone to the formation of microcracks, large debris, and even material fracture during the processing.





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