Processing of Fine Micropores in Special Industrial Ceramics Due to the high hardness and brittleness of special ceramic materials, they are difficult to machine, especially for deep holes and grooves

Due to the high hardness and brittleness of special ceramic materials, they are difficult to machine, especially for deep holes and grooves with a diameter of less than 1mm. Currently, laser processing is widely used. The principle of laser processing is to utilize the high brightness and high directionality of lasers to concentrate light energy within a certain range of space, thereby obtaining a relatively high optical power density and generating high temperatures ranging from thousands to tens of thousands of degrees. At this high temperature, ceramic materials can quickly melt or even vaporize.

The working principle of laser processing determines many drawbacks of laser processing:

1. The workpiece processed by laser has defects such as molten solidification layer and cracks.

2. Due to the focusing process of the laser, the holes processed by the laser will appear conical or barrel shaped.

3. The depth to diameter ratio of laser drilling should not exceed 10, and the thickness should not exceed 2mm, making it impossible to work on some thicker products.

In response to various defects in laser processing, Yichun Sanxin Precision Ceramics has developed a new process for precision machining and cutting of deep micropores and grooves in special ceramics. The machining diameter can reach 0.05mm, the depth can reach 12mm, and the ceramic hole has good roundness, high precision, and good surface roughness.

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